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COG lcd bey' bobcho'

COG lcd bey' bobcho'

COG (Qeb--HIvje') Qeb--HIvje' ((cog)) flip Qeb method 'ej QuQ bogh lo' bonding bare integrated circuits (ic) HIvje' substrate rIp rar Hoch wo' jaS Deghmeymaj Anisotropic Conductive mIllogh qonwI' qoSta' ((acf)) lo'. laH ghISDen ic bumps (footprint) tor according to customers '.

COG (Qeb--HIvje')

Qeb--HIvje' ((cog)) flip Qeb method 'ej QuQ bogh lo' bonding bare integrated circuits (ic) HIvje' substrate rIp rar Hoch wo' jaS Deghmeymaj Anisotropic Conductive mIllogh qonwI' qoSta' ((acf)) lo'. laH ghISDen ic bumps (footprint) tor according to requirements customers (contact tor HIvje' substrate). nIv qIt ghu'vetlh, baS especially potlh 'e' toD logh applications qar crucial packing rIp mIchHom puS reduces method. cost-effective mounting driver Qeb chaw' 'oH HoSqu'mo' flex pcb integrating qawlu' poQ. bonded Hoch wo' onto HIvje' substrate 'ej signals high-speed pagh, jenwI'-Se' DeS yuQmeyDaq ic.

COG cham wa' jenwI'-tech methods 'ej QuQ baS Gold Bump, pagh Flip Qeb ic lo' mounting, 'ej implement 'ach compact applications neH 'oH. wa'DIch lIH Qeb--HIvje' integrated circuits pong epson. pa' mounting flip-Qeb, wej packaged 'ach mounted Hoch wo' onto je Qeb bare pcb ic Qeb. SeH pagh package tu'lu', laH minimized mount footprint ic, along with poQ size pcb. mounting yoS reduces 'ej net poQbej handling high-speed jenwI' Se' signals pagh suit cham.

primarily lo' COG Hal driver ic 'emvo' tft bey' cham nuqDaq lo' chaH lcd, plasma, e-ink, oled pagh 3d cham. ghotvam'e' 'ut consumer va products such as notebooks, tablets, mIllogh qonwI' pagh mobile phones je nIS mach size tlheD-ngI' 'ay' je.

'utmo' Dujvam:

SoHvaD economical size. Qeb--HIvje' lcd bobcho' laH je lang je 2 mm.

cost vaQ rIn COB, especially pa' graphic lcd bobcho', mo' ic mI' reduces.

choghIjtaHghach reliable puS muHIvtaHbogh TAB weakness pa' yoS bond TAB.

disadvantages:

laH neH lo' COG legh be resolution patlh nuqDaq tlhegh 'oHbe' je rup. legh rup tor COG moj QatlhwI' waH 'ej TAB maS ghoS.

chaq vIta'Qo' cost-effective TAB COB, pagh lo' 'IjmeH keypad indicator around bey' ghap integrate designer.

wej botlh mIchHom pov 'emvo' outline offset, 'ach because of mIchHom nuqDaq circuits.


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